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| fedl7582b-06 issue date: jun. 21, 2012 MSM7582B /4 shift qpsk modem 1/29
fedl7582b-06 MSM7582B 2/25 fedl7582b-06 MSM7582B 3/25 fedl7582b-06 MSM7582B 4/25 fedl7582b-06 MSM7582B 5/25 fedl7582b-06 MSM7582B 6/25 fedl7582b-06 MSM7582B 7/25 fedl7582b-06 MSM7582B 8/25 fedl7582b-06 MSM7582B 9/25 fedl7582b-06 MSM7582B 10/25 fedl7582b-06 MSM7582B 11/25 fedl7582b-06 MSM7582B 12/25 fedl7582b-06 MSM7582B 13/25 fedl7582b-06 MSM7582B 14/25 fedl7582b-06 MSM7582B 15/25 fedl7582b-06 MSM7582B 16/25 fedl7582b-06 MSM7582B 17/25 fedl7582b-06 MSM7582B 18/25 fedl7582b-06 MSM7582B 19/25 fedl7582b-06 MSM7582B 20/25 fedl7582b-06 MSM7582B 21/25 fedl7582b-06 MSM7582B 22/25 fedl7582b-06 MSM7582B 23/25 notes for mounting the surface mount type package the surface mount type packages are very susc eptible to heat in reflow mounting and humidity absorbed in storage. therefore, before you perform reflow mounting, contact rohm?s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). fedl7582b-06 MSM7582B 24/25 revision history page document no. date previous edition current edition description fedl7582b-02 nov. 2001 ? ? final edition 2 ? ? final edition 3 fedl7582b-03 jul. 2004 13 13 partially changed the transmitter digital input/output setting time.. 13 13 added t m12 corrected values of serial port digital input/output setting time fedl7582b-04 jun. 8, 2007 15 15 added t m12 corrected figure 8 serial control port interface fedl7582b-05 oct. 13, 2011 ? ? company name change fedl7582b-06 jun. 21, 2012 ? ? modification of property information fedl7582b-06 MSM7582B 25/25 notes no copying or reproduction of this document, in part or in whole, is permitted without the consent of lapis semiconductor co., ltd. the content specified herein is subject to change for improvement without notice. the content specified herein is for the purpose of introducing lapis semiconductor's products (hereinafter "products"). if you wish to use any such product, please be sure to refer to the specifications, which can be obtained from lapis semiconductor upon request. examples of application circuits, circuit constants a nd any other information contained herein illustrate the standard usage and operations of the products. the pe ripheral conditions must be taken into account when designing circuits for mass production. great care was taken in ensuring the accuracy of the information specified in this document. however, should you incur any damage arising from any inaccuracy or misp rint of such information, lapis semiconductor shall bear no responsibility for such damage. the technical information specified herein is intended onl y to show the typical functions of and examples of application circuits for the products. lapis semiconduc tor does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or ot her rights held by lapis semiconductor and other parties. lapis semiconductor shall bear no responsibility whatso ever for any dispute arising from the use of such technical information. the products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-au tomation equipment, communication devices, electronic appliances and amusement devices). the products specified in this document are not designed to be radiation tolerant. while lapis semiconductor always makes efforts to e nhance the quality and reliability of its products, a product may fail or malfunction for a variety of reasons. please be sure to implement in your equipment using the products safety measures to guard against the possibility of physical injury, fire or any other damage cau sed in the event of the failure of any product, such as derating, redundancy, fire control and fail-safe design s. lapis semiconductor shall bear no responsibility whatsoever for your use of any product outside of the pres cribed scope or not in accordance with the instruction manual. the products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunc tion of which may result in a direct threat to human life or create a risk of human injury (such as a me dical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). lapis semiconductor shall bear no responsibility in any way for use of any of the pr oducts for the above special purposes. if a product is intended to be used for any such special purpose, please contact a rohm sales representative before purchasing. if you intend to export or ship overseas any product or te chnology specified herein that may be controlled under the foreign exchange and the foreign trade law, you w ill be required to obtain a license or permit under the law. copyright 2012 lapis semiconductor co., ltd. |
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